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    Piezoelectric ceramic wafers for ultrasonic polishing machine

    Pbulish：admin　　time：2008年03Month21Day

     

    型号及规格

    外型尺寸(mm)
    直径×厚度

    主要技术特征

    fr(MHz)

    Kr

    HF-28/2MC

    φ24/φ8× 5

    64

    0.43

    HF-25/1MC

    φ30/φ10×5

    50

    0.43

    HF-20/1MC

    φ35/φ16×5

    0

    0.42